12 menu "mx6memcal specifics"
14 prompt "Serial console"
16 Either UART1 or UART2 will be used as the console for
17 displaying the calibration values or errors.
19 config SERIAL_CONSOLE_UART1
22 Select this if your board uses UART1 for its' console.
24 config SERIAL_CONSOLE_UART2
27 Select this if your board uses UART2 for its' console.
34 Select the RX and TX pads used for your serial console.
35 The choices below reflect the most commonly used options
38 config UART2_EIM_D26_27
39 bool "UART2 on EIM_D26/27 (SabreLite, Nitrogen6x)"
40 depends on SERIAL_CONSOLE_UART2
42 Choose this configuration if you're using pads
43 EIM_D26 and D27 for a console on UART2.
44 This is typical for designs that are based on the
47 config UART1_CSI0_DAT10_11
48 bool "UART1 on CSI0_DAT10/11 (Wand, SabreSD)"
49 depends on SERIAL_CONSOLE_UART1
51 Choose this configuration if you're using pads
52 CSI0_DAT10 and DAT11 for a console on UART1 as
53 is done on the i.MX6 Wand board and i.MX6 SabreSD.
56 bool "UART1 on UART1 (i.MX6SL EVK, WaRP)"
57 depends on SERIAL_CONSOLE_UART1
59 Choose this configuration if you're using pads
60 UART1_TXD/RXD for a console on UART1 as is done
61 on most i.MX6SL designs.
65 config IMXIMAGE_OUTPUT
66 bool "Include output for imximage .cfg files"
69 Say "Y" if you want output formatted for use in non-SPL
70 (DCD-style) configuration files.
76 Select either 32 or 64 to reflect the DDR bus width.
79 int "DDR chip selects"
83 Select the number of chip selects used in your board design
88 Select the type of DDR (DDR3 or LPDDR2) used on your design
93 Select this if your board design uses DDR3.
98 Select this if your board design uses LPDDR2.
103 prompt "Memory device"
105 config MT41K512M16TNA
106 bool "Micron MT41K512M16TNA 512Mx16 (1GiB/chip)"
110 bool "Micron MT41K128M16JT 128Mx16 (256 MiB/chip)"
114 bool "Hynix H5TQ4G63AFR 256Mx16 (512 MiB/chip)"
118 bool "Hynix H5TQ2G63DFR 128Mx16 (256 MiB/chip)"
121 config MT42L256M32D2LG
122 bool "Micron MT42L256M32D2LG LPDDR2 256Mx32 (1GiB/chip)"
125 config MT29PZZZ4D4BKESK
126 bool "Micron MT29PZZZ4D4BKESK multi-chip 512MiB LPDDR2/4GiB eMMC"
132 int "DDR On-die-termination"
136 Enter the on-die termination value as an index defined for
137 IOMUX settings for PAD_DRAM_SDCLK0_P and others.
146 Value will be applied to all clock and data lines
149 config DRAM_DRIVE_STRENGTH
150 int "DRAM Drive strength"
154 Enter drive strength as an index defined for IOMUX settings
155 for GRP_B1DS and others.
157 6 == 40 Ohm (default)
159 Value will be applied to all clock and data lines
166 Enter the RTT_NOM selector
175 Enter the RTT_WR selector for MR2
176 0 == Dynamic ODT disabled
181 int "Read additional latency"
185 Enter a latency in number of cycles. This will be added to
186 CAS and internal delays for which the MMDC will retrieve the
187 read data from the internal FIFO.
188 This is used to compensate for board/chip delays.
191 int "Write additional latency"
195 Enter a latency in number of cycles. This will be added to
196 CAS and internal delays for which the MMDC will retrieve the
197 read data from the internal FIFO
198 This is used to compensate for board/chip delays.
205 Select the DDR refresh period.
206 See the description of bitfield REF_SEL in the reference manual
214 int "Number of refreshes"
218 This selects the number of refreshes (-1) during each period.
220 0 == 1 refresh (tRFC)
221 7 == 8 refreshes (tRFC*8)
222 See the description of MDREF[REFR] in the reference manual for